- High Thermal Conductivity (1.0–4.0 W/m·K) – Efficiently transfers heat away from components (e.g., LEDs, power electronics).
- Lightweight & Durable – Aluminum provides structural strength while reducing weight compared to steel.
- Electrical Insulation – The dielectric layer isolates the copper circuit from the conductive aluminum base.
- Cost-Effective – More affordable than ceramic substrates for high-power applications.
