High Reliability – Must withstand extreme temperatures, vibrations, and moisture (meets AEC-Q100/Q200 standards).
Complex Designs – Multilayer PCBs with HDI (High-Density Interconnect) technology for compact, high-performance modules.
Automotive-Grade Components – Uses specialized ICs, connectors, and sensors rated for automotive conditions.
Stringent Testing – Undergoes thermal cycling, vibration testing, and EMI/EMC compliance checks.
